S-DIAS: The Super Compact I/O System

Highest packaging density, easily mountable and robust

With up to 20 channels on a width of only 12.5 mm, the new I/O system from SIGMATEK has the highest package density ever reached to date worldwide. The super compact modules impress with dimensions of only 12.5 x 104 x 72 mm (W x H x D). During the development of the new I/O series, great value was placed on the ease of installation and wiring as well as operating safety in addition to the space-saving design.

The S-DIAS series is designed to be a robust complete module solution, which means DIN rail mounting, electronics and bus are combined in one housing. This allows the modules to be quickly pre-assembled individually or in blocks and mounted onto the DIN rail without tools. Since standard connectors with push-in wiring are used, they can be prefabricated in series and during servicing, easily disconnected. Assembly and wiring times are thereby reduced to a minimum.

Especially with such a high channel density as with the S-DIAS system, a clear labeling concept is an absolute necessity. LEDs are provided that give information on the module status, while individual LEDs directly next the channels enable clear identification and diagnostics. Device identification signs can be labeled individually for additional clarity.

The S-DIAS I/Os are mechanically interlocked. The module supply and bus connection were also implemented with multi-contacts. With this well thought-out design, the highest mechanical reliability and vibration resistance is achieved.

With the new, super compact I/O system, standard and Safety components can be combined as desired. The S-DIAS Safety System meets the requirements for SIL 3 in accordance with IEC 62061 and ISO 13849-1, category 4, PL e.


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